Forte 51mm Wet Cut Diamond Hole Saw - ½" BSP Unit of Measure:EACH Ultra-fast hardening self-levelling compound used

Ultra-fast hardening self-levelling compound used for interior levelling and removing differences in thickness of new or existing substrates

Suitable for installation of tile on prepared calcium sulphate screeds (anhydrite)

Vacuum brazed technology

Smooth surface

calibrated and rectified

Forte 51mm Wet Cut Diamond Hole Saw - ½" BSP Unit of Measure:EACH Ultra-fast hardening self-levelling compound usedProven range of high quality laser welded diamond hole cutters for use on very hard ceramics, natural stones and porcelain. 1 2 inch BSP Thread For wet cutting Connected to drill via water fed swivel connector (Stock No: 0915)