Slow Cure 30min Epoxy 255g (9 oz) events µSD card slot for model

µSD card slot for model memory expansion and telemetry data recording

In Constant Voltage (CV) mode

Fluggewicht = ab 150g

voltage alarm

Kugeldurchmesser 1 mm bis 3 mm

Slow Cure 30min Epoxy 255g (9 oz) events µSD card slot for modelSlow Cure 30 min. forms the strongest bonds, is waterproof and more heat resistant than any of the other epoxies in the range. Of course when using it for bonding the only problem is the length of time needed to cure; for handling there is a wait of 8 hours and full strength isnt attained until the 24 hour mark is reached. To very well take advantage of its strength use it to fillet already formed joints. It can be mixed with microbaloons to form a